TIP900
 TIP900 Thermal Imaging System for Wallboard Profiling
Key Features
Complete turnkey industrially designed hardware & software system for wallboard production
User-friendly software with clear graphical overview on a single screen
Detailed continuous board quality monitoring
Real-time detection of bubbles, blisters and clumps
Failure identification function tracked in database
Automatic live rejection of defective boards
Database LogViewer for historical and quality analysis
High resolution thermal imager for accurate infrared images
Complete hardware system configured for harsh environments
Network connectivity for remote communication
Onsite TIP900 system configuration and training of your operators
Accuracy: ±2% of measured value or ±2 ºC (4 ºF), whichever is greater
Temperature Range: 350 ºC max. (662 ºF max.)
Ambient Temperature: 0 to 50 °C (32 to 122 °F)
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